Pasta de soldadura sin plomo de baja temperatura, punto de fusión 138, 183 grados, óptima para iPhone A8, A9, A10, A11, chip, pulpa de estaño especial.
Pasta de soldadura sin plomo de baja temperatura, punto de fusión 138, 183 grados, óptima para iPhone A8, A9, A10, A11, chip, pulpa de estaño especial.
Precio habitual
€37,41 EUR
Precio habitual
Precio de oferta
€37,41 EUR
Impuestos incluidos.
Cantidad
No se pudo cargar la disponibilidad de retiro
Product features
Product features
Materials and care
Materials and care
Merchandising tips
Merchandising tips
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